Process Materials

High purity wet process chemicals for photolithography process in semiconductor device production.


Chemicals for photolithography process

The fabrication of semiconductor devices requires use of high purity wet chemicals for clean, removal, and rinse purposes.

Our offerings include:

  • Edge Bead Remover (EBR)
  • Developer
  • Remover / Stripper

These chemicals enable photolithography technology, which are essential in patterning of microprocessor devices. We guarantee ultra-low particle and trace metals, to address leading market needs.

Edge Bead Remover (EBR)

What are EBR?
  • A solvent mix used to remove photoresist at the substrate edge and backside
Product Range
  • AZ EBR Solvent 
  • AZ 70/30 
  • We offer ultra low metals grade

Developer

What is Development?
  • Development is the step after exposure
  • During development the more soluble part of the resist dissolves away revealing the final desired pattern
  • Positive tone: exposed area is removed
  • Negative tone: non-exposed area is removed
Product Range
Organic Developer; MIF = Metal ion free (with/ without surfactants)
  • AZ 300 MIF
  • AZ 405 MIF
  • AZ 726 MIF
  • AZ 826 MIF
  • AZ 917MIF
Inorganic Developer; MIC = Metal ion containing
  • AZ 400K Series (Potassium containing)
  • AZ 421K (Potassium containing)
  • AZ Developer Series (Sodium containing, low aluminum etch rate)
  • Both concentrates and prediluted are supplied

Remover / Stripper

We have a complete remover portfolio to strip and dissolve resists
  • Positive-tone: DNQ / Novolac, chemically amplified
  • Negative-tone cross-linked
  • Negative-tone photopolymer
Applications 
  • Metal lift-off
  • Copper electroplating
  • CU pillars
  • Solder bumping
  • Through silicon vias
  • Al/ SiO2 and Cu/ low k interconnect technologies
Product Range
  • AZ Remover 100
  • AZ Remover 700
  • AZ Remover 880
  • AZ 300T
  • AZ 400T
  • AZ Kwik Strip

Which remover will clean your resist best?

Product

Type of Chemistry

Positive-Tone

Negative-Tone

DNQ/Novolac

Chemically Amplified

Cross-Linked

Photopolymer

AZ 300T/AZ 400T

Solvent/base

Dissolves

Dissolves

Lifts/ Dissolution in some cases

Lifts but does not dissolve

AZ Remover 100

Solvent/amine

Dissolves

Dissolves

Lifts but does not dissolve

Lifts but does not dissolve

AZ Remover 700

Solvent

Dissolves

Dissolves

Lifts in some cases/ does not dissolve

No data

AZ Remover 880

Solvent/acid

Dissolves

Dissolves

Dissolves

Lifts but does not dissolve

AZ Kwik Strip

Solvent

Dissolves

Dissolves

Lifts/ Dissolution in some cases

Does not lift or dissolve

Metal etch rate data

Product

Type of chemistry

Temp (°C)

Etch rate per metal (?/min)

Al

Cu

Ti

W

TiW

TiN

Sn

Ni

GaAs

AZ 300T

Solvent/

base

80

< 1

2

1

10

5

3

1

1

3

AZ 400T

Solvent/

base

80

< 1

< 1

1

19

12

4

< 1

< 1

6

AZ Remover 100

Solvent/

amine

65

< 1

200

< 1

1

< 1

1

< 1

< 1

5

AZ Remover 700

Solvent

80

< 1

< 1

< 1

< 1

< 1

3

< 1

< 1

< 1

AZ Remover 880

Solvent/

acid

80

9

14

2

< 1

< 1

5

> 166

51

28

AZ Kwik Strip

Solvent

80

< 1

3

1

1

< 1

9

2

1

< 1

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