Photoresists for Back-End Applications

We offer a variety of Thick Film Resists from conventional DNQ & chemically amplified positive tone to photo polymerizing negative tone to make patterned conductive circuitry in semiconductor packages


Enable the manufacturing of TSV, RDL & bumping in advanced packaging

Thick Film Resists (TFR) for backend packaging conductive circuitry is typically made by a bottom up metal plating process inside the same layer of a patterned TFR. 

Independently, resists for frontend processes are designed to develop circuitry patterns that are transferred to the substrate below through a patterned resist photolithography process. These advanced photoresist materials permit current manufacturing production equipment to produce next node products enabling your mobile lifestyle. See our core resist portfolio here.

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